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🔥Last Day Promotion - 70% OFF🔥35g BGA Syringe Tin Solder Paste Leaded Sn63pb37 Melting Point 183 ℃

2015036
Regular price USD $63 Sale price USD $18.9

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🔥Last Day Promotion - 70% OFF🔥35g BGA Syringe Tin Solder Paste Leaded Sn63pb37 Melting Point 183 ℃
18.90
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Hurry up!!! Our first batch of merchandise will be sold out soon! Add your order now!

  • 99.1% Reviewers Recommends This Product.
  • One of our most popular items is back in stock!

BGA syringe solder paste, made for high precision soldering!

Adopts classic Sn63Pb37 formula with precise 183℃ melting point to ensure stable and reliable soldering. Lead-tin alloy optimizes electrical conductivity and improves the strength of solder joints. Simple syringe design for easy operation to meet your professional needs!


SMARTES DESIGN

New technical support, the unique chemical formula provides excellent wetting to ensure high reliability. Adapted to the mobile phone repair industry, the computer digital service industry and high-precision SMT / BGA soldering processes for soldering printed circuit boards.

PCB/BGA DEDIZIERT
High-end quality, unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.


WIDELY APPLICABLE

The residue is colorless and transparent, does not affect detection, is unique and offers brilliant cleaning performance. Use of efficient energy thixotropy agents, pressure and preheating collapse, special solders ensure good pressure and a fine pattern.

REVOLUTIONARY DURABILITY

Wetting, anti-dry, relatively long shelf life at room temperature. Unique high quality solder paste, fine and flexible packaging (35g  / support), filigree appearance.

What is Solder Paste?

  • Solder paste is a new type of solder material that comes with SMT.
  • Solder paste is a complex system consisting of a paste, solder powder, flux and other additives.
  • At normal temperature, the solder paste has a certain viscosity and the electronic component can initially adhere to a predetermined position.
  • At the soldering temperature, the soldered component and the circuit board are soldered together with evaporation of the solvent and some additives (permanent connection).

Precautions:

  • Use only with adequate ventilation.
  • The solder paste contains an organic solvent. Repeat the contact with the skin. If the solder paste gets on your skin, wipe it off with alcohol and then rinse it off thoroughly with water.
  • Avoid contact with the eyes.
  • Keep away from children.

Specification

  • Weight: 35g
  • Package includes: 1 * Sn63Pb37 (with lead mean temperature) 35g + 1 * printhead + 2 * needles


OUR GUARANTEE

  • We can reach every place in the world.
  • Returns>> Fast refund.
  • Email & SMS Tracking: You will receive order status updates via email & SMS messages.

⚡️Stock sells fast - get yours today!

 


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    🔥Last Day Promotion - 70% OFF🔥35g BGA Syringe Tin Solder Paste Leaded Sn63pb37 Melting Point 183 ℃
    Sale price USD $18.9 Regular price USD $63
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